| 摘要 |
PURPOSE:To bore highly precise electron beam pass hole sections on a shadow mask raw material by providing a process pressing an etching liquid resistant film and a process etching large holes and small holes in turn from the respective main faces of the shadow mask raw material. CONSTITUTION:A shadow mask raw material 31 is formed having patterns of small hole formation sections 34 with a bore diameter d1 and large hole formation sections 35 with a bore diameter d2 on both main faces respectively, and an etching liquid resistant film 37 is pressed to both lateral ends of the raw meterial 31 formed with the small hole formation section 34 by using an adhesive agent 36. Next, a large hole 39 as the first predetermined hole is formed by etching to a predetermined depth from the large hole formation sections 35 side, and after a shield agent 40 such as paraffin is filled inside, the film 37 is peeled off, and a small hole 41 is formed by etching from the small hole formation sections 34 side, and after the shield agent 40 is exposed and an electron beam pass hole with a desired diameter is obtained, the shield agent 40 is removed, then a flat mask is completed by removing photosensitive films 32, 33. Accordingly, no film is left at the small hole and large hole formation sections thereby a shadow mask with excellent quality can be obtained. |
