| 摘要 |
PURPOSE:To prevent the shifting of chip position when attaching or detaching a submount by a method wherein a Pb-Sn-In solder is used for adhesion of the submount and a Pb-Sn solder is used for adhesion of a chip to the submount. CONSTITUTION:The Pb-Sn solder 4 consists of 40% of Pb and 50% (wt%) of Sn and its melting point is 183 deg.C, and the Pb-Sn-In solder 2 consists of 38% of Pb, 52% of Sn and 10% (wt%) of In and its melting point is 164 deg.C. Accordingly, when the submount 3 is mounted to or dismounted from a stem 1 by heating up and fusing the solder 4, the Pb-Sn solder 4 to be used to fix a chip 5 is not fused and it is not shifted too, thereby enabling to maintain the accuracy of assembling of the laser diode. |
