| 摘要 |
A composition useful for making circuit boards which is the reaction product of (a) an epoxy resin or an epoxy novolac resin and optionally, a brominated epoxy resin and (b) a bismaleimide; wherein the product of (a) and (b) is subsequently reacted with a curing agent such as a diamine of the formula H2N-R1-NH2 where R1 is an aromatic, aliphatic or cycloaliphatic group. The composition is used to impregnate a fibrous substrate of fiberglass, high temperature polyamides or graphite fibers which is laminated to a copper sheet; the resulting laminate is used to form circuit boards that have good electrical and physical properties.
|
