| 摘要 |
PURPOSE:To miniaturize a package by setting a transparent window on the upper surface of a case, thereby opposing a luminous element and a photoacceptance element at the inner surface of the window arranging them on the same surface and opposing an end surface of a optical fiber at the outside of the window. CONSTITUTION:A window 4 made of a transparent resin 3 is sealed to a case 2 for IC tip 1. A lead 5 and a photodiode 6 are opposed at the inner side of the window arranging them on a same substrate 7. One end of the optical fiber 8 is opposed at the outside of the window and closely sticked to the resin 3 inserting it into a male screw cylinder, thereby fixing it with a cap nut 10 through a packing 11. The package can be miniaturized extremely by arranging the luminous element and the photo-acceptance element at high density. An input light from an optical fiber 8a is given to the photo-acceptance element 6 and then an output signal is transmitted to others through a fiber 8b. |
