发明名称 |
Multiple-chip probe and universal tester contact assemblage |
摘要 |
A probe card assemblage for simultaneously testing one or more integrated circuit chips including an interposer having on one surface a plurality of protruding contact elements for electrically contacting one or more chips of a wafer positioned atop a layer of compliant material, and arrayed in a pattern corresponding to a chip pads, a series of conductive vias through the electrically insulating interposer which connect the chip contact elements with an arrangement of leads terminating in a universal arrangement of connectors on the second surface, and a probe card with connectors mating to those on the interposer. The connectors on the interposer is secured are secured to those on the probe card, thereby providing a vertical probe assemblage which makes use of ultrasonic energy to minimize scrub or over travel. The universal probe card is specific to a tester configuration and common to a family of circuits to be tested.
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申请公布号 |
US6970005(B2) |
申请公布日期 |
2005.11.29 |
申请号 |
US20010915919 |
申请日期 |
2001.07.26 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
RINCON REYNALDO M.;ARNOLD RICHARD W. |
分类号 |
G01R31/26;G01R1/06;G01R1/073;H01L21/66;(IPC1-7):G01R31/06 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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