发明名称 CLEAVING DEVICE FOR SINGLEECRYSTAL PLATE
摘要 <p>PURPOSE:To ensure a high-yield cleaving with addition of the twisting strss positioning the single-crystal plate along the cleaving direction and with an inclination and applying the vertical external stress. CONSTITUTION:Marking-off groove 6 is provided previously at the edge part of crystal plate 5, and holding plate 3 and 4 are distributed along the desired cleaving line with theirr tips opposed to each other. An inclination is given to the lower plate 31 and 41 of the holding plates against the surface of plate spring 2 ad along the cleaving direction of plate 5. When the mobile edge side of the plate spring is pressed down, plate 4 lowers down to apply the desired stress to the crystal plate. As a result, the cleaving is stared with the marking-off groove set as the starting point.</p>
申请公布号 JPS5480070(A) 申请公布日期 1979.06.26
申请号 JP19770147562 申请日期 1977.12.08
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 IIDA SEIJI
分类号 H01L21/301;H01L21/302 主分类号 H01L21/301
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