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发明名称
BONDING METHOD OF SEMICONDUCTOR CHIPS
摘要
申请公布号
JPS5410670(A)
申请公布日期
1979.01.26
申请号
JP19770075483
申请日期
1977.06.27
申请人
FUJITSU LTD
发明人
OGATA SHIYOUICHI;OOISHI HIROSHI
分类号
H01L21/52;H01L21/58
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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