发明名称 MANUFACTURE OF COMPOSITE MULTILAYER PRINTED WIRING BOARD
摘要 <p>PURPOSE:To prevent a flexible part from peeling between layers by incorporating a part corresponding to an exposed part of a flexible printed wiring board in a hard printed wiring board before laminated layers are adhered, and providing removal auxiliary means in the part. CONSTITUTION:A both-side FPC 1 formed with a cover layer film after pattern etching, an adhesive sheet 2 opened at a part corresponding to a flexible part, and a one-side copper-plated PWB 3 are thermally press-adhered. In this case, the PWB 3 is formed in advance with a groove 6 by spot facing from the surface to be adhered with the FPC 1 along a boundary between a hard part and the flexible part. Thereafter, after a through-hole pattern 10 and a conductor pattern 11 are formed, a profile is formed. Then, an electronic part is mounted by using a far infrared ray type solder reflowing furnace, a peripheral part 9 for holding the hard part 9 is cut after mounting, the PWB 12 opposed to the part 7 is vertically deviated as a whole wiring board to be removed by cutting, thereby exposing the part 7.</p>
申请公布号 JPH0327593(A) 申请公布日期 1991.02.05
申请号 JP19890162002 申请日期 1989.06.23
申请人 SHARP CORP 发明人 YAMAGUCHI CHIHIRO
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
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