| 摘要 |
PURPOSE:To stabilize the shape of a conductor, to prevent an undesirable contact with other members and to improve the reliability of electrical connection by forming a protruding section positioned between the first and second electrodes and positioned at a place higher than these electrodes on a jig under the state in which these electrodes are installed to the jig. CONSTITUTION:A heat stage 20 functions as a jig for positioning a lead frame in the horizontal direction and regulating the position in the vertical direction of a bonding wire besides heating for bonding. The protruding sections 23, 24 of the heat stage 20 are inserted into a space 4d among the mount section 4b of the lead frame and each lead 4a. The upper ends of the protruding sections 23, 24 of the heat stage 20 are made higher than the bonding pad 16 of an IC chip 15 and the leads 4a under the state in which the lead frame is set, the bonding wire 13 is placed on the protruding sections 23, 24, the bonding wire is not brought into contact with the side end of the IC chip 15, and the deformation of the bonding wire is corrected by the protruding sections 23, 24 even when the bonding wire is deformed. |
