| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is rapidly developed and stripped, has good adhesion, etching and plating resistances, and forms a conductor pattern excellent in linearity, and also to provide a resist pattern using the same and a conductor pattern. <P>SOLUTION: The photosensitive resin composition comprises: (A) 30-75 mass% of an alkali-soluble polymer; (B) 15-60 mass% of one or more addition-polymerizable monomers selected from the group of specified addition-polymerizable monomers; (C) 0.01-20 mass% of a photopolymerization initiator; and (D) 0.5-30 mass% of a copolymer of specified ethylene oxide and propylene oxide having a weight average molecular weight of 200-5,000. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
