| 摘要 |
PROBLEM TO BE SOLVED: To calculate the highly accurate equivalent heat conductivity of an electronic substrate in consideration of a wiring partial area ratio at every place. SOLUTION: In a step S1, the configurational data (a contour outer shape, the position or dimension of a hole when the hole is present in an electronic substrate, the thicknesses of an electrode pattern layer and an insulating layer, electrode pattern shapes of respective electrode pattern layers) of an electronic substrate is obtained. In a step S2, the heat conductivity of a metal material constituting an electrode pattern layer and the heat conductivity of a resin material constituting the non-wiring part of the electrode pattern layer and an insulating layer are obtained. In a step S3, the electronic substrate is divided into small regions and, in a step S4, the wiring part areal ratio of the electrode pattern layers at every small regions is calculated. In a step S5, the in-plane directional equivalent heat conductivity of the electronic substrate is calculated with respect to each small region and, in a step 6, the calculated equivalent heat conductivity is outputted.
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