POWER SEMICONDUCTOR MODULE AND ELECTRIC POWER CONVERSION DEVICE

摘要

The purpose of the present invention is to achieve reduction in both height and size of a double-sided cooling electric power conversion device. This power semiconductor module comprises: a circuit body 302 including a power semiconductor element and a terminal; and a case 304 forming a housing space 306 for housing the circuit body 302. The case 304 includes: a first heat-dissipating section 305a and a second heat-dissipating section 305b that are arranged in opposition to one another across the housing space 306; a first opening 311 that is arranged in a side section of the first heat-dissipating section 305a and through which the terminal is passed; a seal surface 309 formed so as to surround the first opening 311; and a reference surface 308 arranged in a side section of the second heat-dissipating section 305b. The reference surface 308 is formed on a surface of the case 304 on the opposite side from the surface where the seal surface 309 is arranged in a manner such that, when the reference surface 308 is projected from the perpendicular direction thereof, the projected section of the reference surface 308 and the projected section of the seal surface 309 overlap one another.