发明名称 |
Method for applying connecting materials for connecting a microchip and a substrate, method for producing an electrical and mechanical connection between a microchip and a substrate and utilization of a printing head working according to the ink printing principle |
摘要 |
The invention relates to a method for applying connecting materials for a connection between a microchip and a substrate, whereby an electrically conductive material is used to establish the electrical connection and a filling material is applied on the microchip and/or substrate for the mechanical connection between the substrate and the microchip. According to the invention, the electrically conductive material (3) and/or the filling material (5) are sprayed successively or simultaneously on the substrate (6) and/or the microchip (1) using at least one printing head (9) working according to the ink printing principle. |
申请公布号 |
AU6432500(A) |
申请公布日期 |
2001.01.22 |
申请号 |
AU20000064325 |
申请日期 |
2000.07.06 |
申请人 |
EKRA EDUARD KRAFT GMBH |
发明人 |
WOLFGANG WEHL |
分类号 |
H01L21/48;H01L21/56;H01L21/60 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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