发明名称 APPARATUS AND METHOD FOR JOINTING OF LEAD OF ELECTRONIC COMPONENT
摘要 PURPOSE:To form a highly accurate and high quality bump on an electrode pad by compression bonding, reduce the damage of a jointed member when a lead is jointed with the jointed member, perform accurate alignment and, further, perform the attraction and feed of a metal ball, the formation of the bump and the calking joint with one tool. CONSTITUTION:A highly accurate and high quality metal ball which is formed beforehand metallurgically stably is selectively attracted by the tip part of a capillary tool 3 and the metal ball is deformed by compression on a compression-bonded member such as an electrode pad 7a to form a nail head shaped bump 16. Further, the center hole 14a of a lead is retained with the center protrusion 16a of the bump 16 and the calking joint is performed by compression with the pressing flat part 3h of the capillary tool 3.
申请公布号 JPH07130749(A) 申请公布日期 1995.05.19
申请号 JP19930292773 申请日期 1993.10.28
申请人 SONY CORP 发明人 YAMAMOTO HIDEHARU
分类号 B23K1/00;B23K1/06;H01L21/321;H01L21/60 主分类号 B23K1/00
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