| 摘要 |
Provided is a circuit structure in which wires are less prone to breaking due to a change in the shape of a resin molding. A circuit structure (1) is provided with: an electronic component (3) having electrodes (31, 32); a resin molding (2) in which the electrode component (3) is embedded; and wires (41, 42) connected to the electrodes (31, 32). A groove (21) is formed around the electronic component (3) in the resin molding (2). The wires (41, 42) are provided so as to pass through the groove (21) interior. |
