| 发明名称 |
PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE AND PRODUCTION METHOD FOR SAME |
| 摘要 |
A printed circuit board according to the present invention comprises: an insulating substrate; a plurality of pads formed on the upper surface of the insulating substrate; a protective layer which comprises an opening part for exposing the upper surfaces of the plurality of pads, and is formed on the insulating substrate; and a metal bump which is formed on the first pad and the second pad in the plurality of pads, and projects above the surface of the protective layer, and, here, the first pad is formed to the left of the central upper part of the insulating substrate, while the second pad is formed to the right of the central upper part of the insulating substrate. |
| 申请公布号 |
US2016351543(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201515117345 |
申请日期 |
2015.01.28 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
RYU Sung Wuk;KIM Dong Sun;LEE Ji Haeng;NAM Sang Hyuck |
| 分类号 |
H01L25/065;H01L25/00;H01L21/48;H01L23/498;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
an insulating substrate; a plurality of pads disposed on an upper surface of the insulating substrate; a protective layer disposed on the insulating substrate, the protective layer comprising an opening exposing upper surfaces of the plurality of pads therethrough; a first bump disposed on a first pad and a second pad among the plurality of pads, the first bump protruding upward of a surface of the protective layer; a second bump disposed on the first bump; a solder ball disposed on the second bump; and an electronic device attached onto at least one third pad among the plurality of pads by a bonding ball disposed on the third pad. |
| 地址 |
Seoul KR |
