| 发明名称 | Computational wafer inspection | ||
| 摘要 | Disclosed herein is a computer-implemented defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method comprising: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; and determining or predicting, using the actual value, an existence, a probability of existence, a characteristic, or a combination selected therefrom, of a defect produced from the hot spot with the device manufacturing process. | ||
| 申请公布号 | US9507907(B2) | 申请公布日期 | 2016.11.29 |
| 申请号 | US201514730993 | 申请日期 | 2015.06.04 |
| 申请人 | ASML NETHERLANDS B.V. | 发明人 | Fouquet Christophe David;Kastrup Bernardo;Den Boef Arie Jeffrey;Mulkens Johannes Catharinus Hubertus;Kavanagh James Benedict;Koonmen James Patrick;Callan Neal Patrick |
| 分类号 | G06F17/50;H01L21/66;G03F7/20 | 主分类号 | G06F17/50 |
| 代理机构 | Pillsbury Winthrop Shaw Pittman LLP | 代理人 | Pillsbury Winthrop Shaw Pittman LLP |
| 主权项 | 1. A defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method comprising: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot using the device manufacturing process; determining an actual value of the processing parameter; and determining or predicting, using the actual value and by a computer hardware system, an existence, a probability of existence, a characteristic, or a combination selected therefrom, of a defect produced from the hot spot using the device manufacturing process. | ||
| 地址 | Veldhoven NL | ||