发明名称
摘要 PROBLEM TO BE SOLVED: To provide a method of packaging adhesive hot melt with which packaging with which blocking hardly occurs is possible in a relatively simple apparatus and an amount of impurities can be minimized. SOLUTION: The method comprises steps of extruding the hot melt which has been heat-fused from a nozzle into water for cooling, taking out a hot melt solid obtained by the cooling from the water for dehydration, and then putting over a heat-fused film which is wider than the solid and has a fluxing point measured by a differential scanning calorimeter(DSC) preferably of 70 to 130 deg.C to cover the solid.
申请公布号 JP4529001(B2) 申请公布日期 2010.08.25
申请号 JP20010146181 申请日期 2001.05.16
申请人 发明人
分类号 B65B29/00;B65B51/10;B65B63/08;C09J201/00 主分类号 B65B29/00
代理机构 代理人
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