| 摘要 |
An LED array according to an embodiment of the present invention includes: a plurality of LED packages including a chip on board (COB) type first substrate and an LED chip arranged on the first substrate, and a silicon cover arranged on the first substrate; and a second substrate where the LED packages are mounted. The silicon cover includes an upper surface facing the upper surface of the LED chip, and first lateral surfaces facing each other and second lateral surfaces facing each other. The LED package further includes a reflection layer arranged on the second lateral surface. So, the total number of LED packages can be reduced. |
