| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element which suppresses an etching depth required for obtaining an intended rough surface shape while maintaining a carrier confinement effect of a clad layer thereby to inhibit the occurrence of chipping at the time of wire bonding.SOLUTION: A light emitting element having a window layer-support substrate, and a light emitting part which is provided on the window layer-support substrate and has a second conductivity type second semiconductor layer, an active layer and a first conductivity type first semiconductor layer in this order comprises: a first ohmic electrode provided on the first semiconductor layer; and an insulating protection film which covers a surface of the first semiconductor layer and at least a part of a lateral face of the light emitting part. The surface of the first semiconductor layer and a surface of the window layer-support substrate are roughened, and the first semiconductor layer is composed of a structure of at least two layers in which the layer on the side subjected to a roughening treatment is composed of a material having less Al composition in comparison with the layer on the active layer side.SELECTED DRAWING: Figure 1 |
