| 摘要 |
An apparatus for applying a pre-printed transfer to a substrate at an elevated temperature and under increased pressure is disclosed. The apparatus includes a framework, an enclosure containing a plurality of control mechanisms, a heated platen assembly, and an index mechanism. The heated platen assembly comprises a first member capable of vertical travel and a second member that is removable. The pre-printed transfer is positioned proximate the second member and the substrate is positioned proximate the first member. The index mechanism has at least a supply portion for holding a continuous web of pre-printed transfers and a collection portion for receiving the continuous web after the pre-printed transfer has been applied to the substrate. Also disclosed is a method of applying a pre-printed transfer to a desired substrate utilizing this apparatus.
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