半导体封装基座的制造方法;METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE

摘要

本发明提供一种半导体封装基座的制造方法。包括：提供一载板，该载板的一顶面和一底面上具有复数个导电种晶层；分别于该些导电种晶层上形成复数个第一导线；将一第一基座材料层和一第二基座材料层分别堆叠于该些导电种晶层上，且覆盖该些第一导线；分别于该第一基座材料层的一第一表面和该第二基座材料层的一第一表面上形成复数个第二导线，该第一基座材料层的该第一表面和该第二基座材料层的该第一表面分别远离该载板的该顶面和该底面；以及将带有该些第一导线和该些第二导线的该第一基座材料层以及将带有该些第一导线和该些第二导线的该第二基座材料层分别从该载板的该顶面和该底面分离，以形成一第一基座和一第二基座。; forming first conductive traces respectively on the conductive seed layers; performing a laminating process to respectively dispose a first base material layer and a second base material layer on the conductive seed layers, covering the first conductive traces; forming second conductive traces respectively on first surfaces of the first base material layer and the second base material layer, wherein the first surfaces of the first base material layer and the second base material layer are respectively away from the top surface and the bottom surface of the carrier; and separating the first base material layer containing the first and second conductive traces thereon and the second base material layer containing the first and second conductive traces thereon from the carrier to form a first base and a second base.