| 摘要 |
PURPOSE:To improve heat dissipation without deteriorating the connection packaging life when the thermal expansion coefficient of a flip chip IC is different from that of a first substrate, by connecting them via a second substrate having a thermal expansion coefficient whose value is between the coefficients of the flip chip IC and the first substrate. CONSTITUTION:In a packaging structure wherein a flip chip IC 1 is mounted on a first substrate 10 composed of material whose thermal expansion coefficient is different from that of the flip chip IC 1, the flip chip IC 1 is connected with a second substrate 6 via solder bumps 3. The second substrate has a thermal expansion coefficient whose value is between the coefficients of the flip chip IC 1 and the first substrate 10. The flip chip IC 1 is inserted into an aperture 11 formed in the first substrate 10. The aperture 11 corresponds with the outer form of the flip chip IC 1, and the inner form of the aperture is a little larger than the outer form of the IC 1. The second substrate 6 is connected with the first substrate 10 via solder bumps 3 formed on the surface of the second substrate 6 on the periphery of the flip chip IC 1. |
