| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for sealing a semiconductor having good clearance penetrating properties, proving a cured product having good adhesive properties to a coating material of a silicon chip surface, and providing a semiconductor device having a high reliability, and to provide the semiconductor device sealed with the composition. SOLUTION: The liquid epoxy resin composition for sealing the semiconductor includes the liquid epoxy resin and an inorganic filler. The inorganic filler used for the composition is surface-treated with a composition having general formula (1) (R is a 1-6C alkyl group; n is an integer of 1-5.), has particles having a particle diameter of 45μm or more in a content of 1 wt.% or les of the total and has an average particle diameter of 0.1 to 10μm. As a result, the cured product having good adhesive properties to the coating material of the chip surface, particularly to a surface coated with silicon nitride is obtained. The composition is particularly useful as an under-fill material for a flip chip or the like, and the semiconductor device sealed with the epoxy resin composition is highly reliable.
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