METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER

摘要

PURPOSE: A method for manufacturing a semiconductor wafer is provided to improve a yield by equally coating the wafers with a constant thickness using a chemical. CONSTITUTION: A fabrication method of semiconductor wafers comprises the first step(S100) for detecting a temperature of the semiconductor wafer, the second step(S110) for detecting a temperature of a chemical for coating the semiconductor wafer, the third step(S120) for deciding whether the semiconductor wafer temperature is same with the chemical temperature or not and the fourth step(S130) for continuously controlling the temperatures of both the semiconductor wafer and the chemical to be same when the temperatures are not corresponding with each other. At this point, the chemical is a photoresist.