Semiconductor structure including a die seal leakage detection material, method for the formation thereof and method including a test of a semiconductor structure

摘要

A semiconductor structure includes a semiconductor substrate, one or more interconnect layers provided over the substrate and a circuit. The circuit includes a plurality of circuit elements formed at the substrate and a plurality of electrical connections provided in the one or more interconnect layers. A die seal is provided in the one or more interconnect layers. A die seal leakage detection material is arranged in the one or more interconnect layers between the die seal and the plurality of electrical connections. The die seal provides a protection of the die seal leakage detection material from moisture if the die seal is intact. The die seal leakage detection material is adapted for providing a detectable modification of the circuit after an exposure of the die seal leakage detection material to moisture.

主权项

1. A semiconductor structure, comprising:
a semiconductor substrate; one or more interconnect layers provided over said substrate; a circuit, said circuit comprising a plurality of circuit elements formed on said substrate and a plurality of electrical connections provided in said one or more interconnect layers; a die seal provided in said one or more interconnect layers, said die seal surrounding at least said plurality of electrical connections of said circuit; and a die seal leakage detection material arranged in a trench extending through said one or more interconnect layers between said die seal and said plurality of electrical connections, wherein said trench surrounds at least said plurality of electrical connections of said circuit, said die seal provides a protection of said die seal leakage detection material from moisture if said die seal is intact, and said die seal leakage detection material comprises an insulating material configured to expand after said exposure of said die seal leakage detection material to moisture to provide a detectable modification of said circuit after an exposure of said die seal leakage detection material to moisture.