CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a conductive particle capable of reducing connection resistance between electrodes and further suppressing rise of the connection resistance under high temperature and high humidity when a connection structure is obtained by connecting the electrodes.SOLUTION: The conductive particle 1 has a substrate particle 2 and a conductive layer 3 arranged on a surface of the substrate particle 2. The conductive layer 3 contains at least one metal component of nickel, tungsten and molybdenum. The content of nickel is 60 wt.% or more based on 100 wt.% of the whole conductive layer 3. The content of sum of tungsten and molybdenum is over 5 wt.% based on 100 wt.% of a conductive layer part with 5 mm thickness from an outside surface of the conductive layer 3 to an inner side in a thickness direction.SELECTED DRAWING: Figure 1