| 摘要 |
PROBLEM TO BE SOLVED: To provide a division method and a division device capable of dividing a bonded substrate, obtained by bonding a silicon substrate and a glass substrate by an adhesive layer, appropriately.SOLUTION: A method for dividing a bonded substrate at a predetermine scheduled division position includes a scribe line formation step (unit) of forming a scribe line, at a scheduled division position on one principal surface of a glass substrate, by irradiating with laser light, a dicing groove formation step (unit) of forming a groove, at a scheduled division position on one principal surface of a silicon substrate, from one principal surface of a silicon substrate to the way of an adhesive layer, by a predetermined groove formation means, and a break step (unit) of breaking the bonded substrate, in which the scribe line and a groove are formed, between the scribe line and the groove.SELECTED DRAWING: Figure 7 |
