Dense out of plane interconnect inside hermetically sealed modules

摘要

A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.

主权项

1. A hermetically sealed module comprising:
a central core housing including a perimeter side wall and a central core having opposed primary and secondary support surfaces; at least one coupling passageway being formed within the central core adjacent the perimeter side wall of central core housing; a sealed electrical connector interface which facilitates communication with components accommodated within the central core housing; a multilayer substrate, having at least one flexible coupling tab, being supported by the primary support surface; at least one surface mounted component being supported by the secondary support surface; the at least one flexible coupling tab passing through the at least one coupling passageway and a SMT connector couples a plurality of signal traces of the multilayer substrate with an electrical connection array of the at least one surface mounted component; and primary and secondary lids being respectively securing to opposed sides of the perimeter side wall to form the hermetically sealed module.