| 发明名称 | Solder paste | ||
| 摘要 | A solder paste includes a flux and powder mixed with the flux, where the powder includes first powder and second powder mixed with each other. The first powder may be a tin (Sn) and at least one metal dissolved in the tin (Sn), and the second powder may be a copper (Cu) powder, the surface of which is coated with silver (Ag). | ||
| 申请公布号 | US9610655(B2) | 申请公布日期 | 2017.04.04 |
| 申请号 | US201414272127 | 申请日期 | 2014.05.07 |
| 申请人 | LG INNOTEK CO., LTD. | 发明人 | Hwang Deok Ki |
| 分类号 | B23K35/02;B22F1/02;B23K35/26;B23K35/30;B23K35/36;B23K35/24;B23K1/00;H05K3/34;H01L23/00;B22F1/00;B23K35/00;C22C1/04 | 主分类号 | B23K35/02 |
| 代理机构 | KED & Associates, LLP | 代理人 | KED & Associates, LLP |
| 主权项 | 1. A solder paste comprising: a flux including rosin, a thinner and an activator; and a mixed powder mixed with the flux, the mixed powder including first powder and second powder mixed with each other, wherein the first powder includes tin and at least one metal dissolved in the tin, and the second powder includes a copper powder, and an Ag coating film formed on a surface of the copper powder, wherein a diameter of the copper powder included in the second powder is in a range of 4 μm to 7 μm and a thickness of the Ag coating film is 1 μm or less, and wherein the activator is present in an amount of 40% to 60% based on the total weight of the flux. | ||
| 地址 | Seoul KR | ||