| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for filling an open hole having a pore diameter of 10 to 100 μm, a pore length of 50 to 1000 μm and an aspect ratio (length/diameter) of 1 to 20 as a size with an electric copper plating.SOLUTION: A composition of a plating liquid and a plating condition are adjusted in 4 steps which are a plating initiation step, a preferential deposition step in a hole inner, a deposition connection step in the hole inner, and a filling step from the inner to a surface, which are sequentially continuous in the process. |
