| 发明名称 | Semiconductor device | ||
| 摘要 | A semiconductor device includes a base, a semiconductor element disposed on the base, a resist layer formed on the base, and a resin-sealed portion covering the semiconductor element and the resist layer. A plurality of concave portions is formed in the resist layer, and each of the plurality of concave portions is filled with a part of the resin-sealed portion. | ||
| 申请公布号 | US9537019(B2) | 申请公布日期 | 2017.01.03 |
| 申请号 | US201414566197 | 申请日期 | 2014.12.10 |
| 申请人 | Rohm Co., Ltd. | 发明人 | Toyama Tomoichiro |
| 分类号 | H01L31/0203;H01L31/0236;H01L31/02;H01L33/54;H01L33/48 | 主分类号 | H01L31/0203 |
| 代理机构 | Hamre, Schumann, Mueller & Larson, P.C. | 代理人 | Hamre, Schumann, Mueller & Larson, P.C. |
| 主权项 | 1. A semiconductor device comprising: a base; a semiconductor element disposed on the base; a wiring pattern formed on a front surface of the base, and made of conductive material; a resist layer formed on the front surface of the base, and covering at least a portion of the wiring pattern; a resin-sealed portion covering the semiconductor element and the resist layer; and a plurality of concave portions formed through first portions of the resist layer, different from second portions of the resist layer covering the at least the portion of the wiring pattern, exposing the front surface of the base from the resist layer, and each of the plurality of concave portions filled with a part of the resin-sealed portion to strongly engage the resist layer and the resin-sealed portion. | ||
| 地址 | Kyoto JP | ||