| 发明名称 |
CURABLE COMPOSITION |
| 摘要 |
Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no surface stickiness, and an excellent adhesive property. The curable composition has excellent thermal resistance, crack resistance, and gas permeability. The curable composition may have stable performance when being applied to a semiconductor device at a high temperature for a long time. |
| 申请公布号 |
US2016289389(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201414778506 |
申请日期 |
2014.04.04 |
| 申请人 |
LG CHEM, LTD. |
发明人 |
KO Min Jin;KIM Kyung Mi;PARK Young Ju |
| 分类号 |
C08G77/12;C08G77/14;H01L33/56;C08G77/20 |
主分类号 |
C08G77/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A curable composition, comprising:
(A) a polyorganosiloxane having an aliphatic unsaturated bond, and a molar ratio (Ar/Si) of an aryl (Ar) group to a silicon (Si) atom of 0.2 or less; and (B) a polyorganosiloxane including a hydrogen atom and an aryl group, which bind to a silicon atom, having a molar ratio of an aryl (Ar) group to a silicon (Si) atom of 0.25 or more, and having 3 to 10 silicon atoms. |
| 地址 |
Seoul KR |
