METHOD FOR PRODUCING AN INTEGRATED CIRCUIT PACKAGE AND APPARATUS PRODUCED THEREBY

摘要

A processor-implemented method and integrated circuit package are provided. According to an implementation, a method of producing a chip package includes de-populating solder balls at selected locations in a fine pitch package, and providing test pads at the de-populated solder ball locations. In an example implementation, the method comprises receiving and modifying a package design. In an implementation, a row of test pads in an integrated circuit package is provided in a plurality of concentric annular rows, the row of test pads being adjacent an outer row of via-connected solder balls and adjacent an inner row of via-connected solder balls. In an implementation, test pads are located on a PCB-facing surface of the package at a subset of locations opposing at least one via position on a package-facing surface of the PCB. The test pads maintain a large number of signal pins and do not interfere with the via.

主权项

1. A method of producing an integrated circuit package for connecting to a printed circuit board, the method comprising:
receiving an initial fine pitch integrated circuit package design defined with respect to a grid having a plurality of ball locations; identifying one or more de-population locations in the initial design, the de-population locations corresponding to a subset of the plurality of ball locations and having solder balls assigned thereto in the initial design, the initial design defining an initial inter-ball region between adjacent first and second solder balls in the one or more de-population locations, the initial inter-ball region being smaller than a via-facing region; modifying the initial design to insert, at a selected de-population location in the one or more de-population locations, a test pad instead of the second solder ball to produce a modified fine pitch integrated circuit package design, the modified design defining, based on removal of the second solder ball from the selected de-population location, a modified inter-ball region between the first solder ball and an adjacent third solder ball, the modified inter-ball region being greater than the via-facing region and greater than the initial inter-ball region.