SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a sensor package capable of minimizing an internal mass body or an internal cap to be damaged due to an external shock or the likes and a manufacturing method thereof. The sensor package according to an embodiment of the present invention comprises: a base which includes the mass body arranged in a space formed in the inner side and a plurality of connection units to connect the mass body; and one or more caps to protect the mass body by being combined with one side of the base. The cap includes one or more buffer members formed in an inner wall which faces the mass body.