| 摘要 |
The present invention relates to a substrate inspection method which can conveniently perform checking whether a contact is in contact with an inspection point in a short time. The substrate inspection method performs a four-terminal measurement method with respect to the wiring pattern of a substrate, on which multiple wirings are formed. An upstream-side detection terminal connected to a detection means and contacts connected to the downstream-side detection terminal are connected in series. Power is supplied to the contacts connected in series. Electrical measurement is performed between the contacts connected in series. An electrical characteristic between the contacts connected in series is calculated from the power and the result of the electrical measurement. The state of a through contact between the contacts connected in series and the inspection point is determined based on the calculated electrical characteristic. |
