发明名称 THERMALLY CONDUCTIVE POLYMER ARTICLES FOR ELECTRONIC CIRCUITRY
摘要 A thermally conductive polymer article is disclosed, made from a polymer resin and thermally conductive additives, wherein the article has undergone laser structuring and plasma metallization and, preferably, surface-mount technology (SMT) by non-lead reflow soldering, to provide an integrated circuit. The article can be in the shape of a printed circuit board or a LED lighting component among other possibilities. The thermally conductive additive can be either electrically insulative or electrically conductive, or both types can be used. The thermally conductive polymer compound can be extruded, molded, calendered, thermoformed, or 3D-printed before taking shape as a heat dissipating, laser structured, and plasma metalized polymer article.
申请公布号 WO2016057418(A1) 申请公布日期 2016.04.14
申请号 WO2015US54066 申请日期 2015.10.05
申请人 POLYONE CORPORATION 发明人 CHABANNE, PHILIPPE;MAURER, RENAUD
分类号 C08J7/04;C08K3/22;C08L81/02;C08L101/12 主分类号 C08J7/04
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