| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in which information pertaining to the shape of an edge defect of a wafer cannot be properly acquired.SOLUTION: A wafer information processing device is provided with: a defect rotation distance information storage unit 101 in which a plurality of defect rotation distance information corresponding to an edge defect are stored, the information having a rotation angle when a wafer is rotated and distance information pertaining to a distance from the center of rotation of the wafer that corresponds to the rotation angle in correlation to each other; a conversion unit 102 for performing Fourier transformation on the plurality of defect rotation distance information; a shape acquisition unit 103 for acquiring shape-related information pertaining to the shape of the defect that corresponds to the plurality of defect rotation distance information, by using the result of Fourier transformation acquired by the conversion unit 102; and an output unit 104 for outputting the shape-related information acquired by the shape acquisition unit 103. It is thereby made possible to properly acquire information pertaining to the shape of a defect.SELECTED DRAWING: Figure 1 |
