| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board with superior folding endurance.SOLUTION: A printed circuit board 100 includes: a core substrate 30 where fiber base material is embedded in first resin; a pair of second resin layers 10 arranged to hold the core substrate 30 between them; and a conductor 7 arranged on at least one of a surface 100a opposed to a side of the core substrate 30 in the resin layer 10 on an interface of the resin layer and the core substrate. The thickness of the fiber base material of the printed circuit board 100 is 40 μm or less, and a tension elastic modulus in a cured object of the first resin at temperature of 25°C is larger than that in the second resin layers 10 at temperature of 25°C and also 3.0 GPa or less. |
