| 摘要 |
A sacrificial layer (600) is formed on the back surface of a piezoelectric substrate (200) (S101). A supporting layer (300) is formed on the back surface of the piezoelectric substrate (200) so as to cover the sacrificial layer (600) (S102). The supporting layer (300) is planarized, thereby forming a supporting layer (30) for a piezoelectric resonator (10). By polishing the supporting layer (30) and the surface of the sacrificial layer (600), a recessed portion (31) where the surface of the sacrificial layer (600) is more recessed than the surface of the supporting layer (30) is formed (S103). The recessed portion (31) has a shape that extends around the interface between the supporting layer (30) and the sacrificial layer (600) in the supporting layer (30). A supporting substrate (40) is bonded to the surfaces of the supporting layer (30) and the sacrificial layer (600), said surfaces having the recessed portion (31), with use of an adhesive material (50) (S104). Due to the formation of the recessed portion (31), the adhesion strength between the sacrificial layer (600) and the supporting substrate (40) is decreased, so that the sacrificial layer (600) is more easily removed during a step for removing the sacrificial layer (600). |
