Liquid-based pressure sensitive adhesive for grounding applications

摘要

An electronic device may be provided with electronic device structures such as housing structures, antenna structures, printed circuits, and structures associated with electrical components. The structures may be attached to each other using adhesive. A liquid pressure sensitive adhesive precursor material is deposited onto one or more surfaces of structures to be bonded. Light or heat can be applied to cure the liquid adhesive material and form pressure sensitive adhesive layers. During curing, chemical bonds are formed between the adhesive material and the structures. Assembly equipment may press the structures together to form pressure sensitive adhesive bonds that can be reworked without disturbing the chemically bonded portions of the adhesive material. The pressure sensitive adhesive may include conductive particles for forming conductive paths.

主权项

1. A method for assembling structures in an electronic device, comprising:
applying liquid pressure sensitive adhesive precursor material to a first structure in the electronic device; curing the liquid pressure sensitive adhesive precursor material on the first structure to form a first pressure sensitive adhesive layer; applying liquid pressure sensitive adhesive precursor material to a second structure in the electronic device; curing the liquid pressure sensitive adhesive precursor material on the second structure to form a second pressure sensitive adhesive layer; and pressing together the first and second pressure sensitive adhesive layers to attach the first and second structures.