| 摘要 |
PROBLEM TO BE SOLVED: To provide a batch type substrate processing device in which a discharge port for dry promoting gas can be located at the position corresponding to the gap between back surfaces of substrates irrespective of change of an arrangement pattern of the substrates.SOLUTION: The relative positional relationship regarding the substrate arrangement direction of substrates between plural substrates held by a substrate holding tool and plural discharge ports of a nozzle for discharging dry promoting gas such as IPA vapor or the like can be adjusted. When the substrates are arranged in a first arrangement pattern in which the surfaces of even-numbered substrates face a first direction and the surfaces of odd-numbered substrates face a second direction, and when the substrates are arranged in a second arrangement pattern in which the surfaces of the even-numbered substrates face the second direction and the surfaces of the odd-numbered substrates face the first direction, the adjustment is performed by displacing the position of the substrate holding member during delivery of a substrate from the substrate holding member (22a) of a substrate feeding device (22) to the substrate holding tool (124) by only the displacement corresponding to the arrangement pitch of the substrate in the arrangement direction of the substrate (W). |
