| 发明名称 |
HEAT CHANNELING AND DISPERSING STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A heat channeling and dispersing structure includes a substrate, a printed circuit board, and a heat-producing electronic element on the printed circuit board. The printed circuit board is mounted on the substrate, which defines a through hole filled with filler. The electronic element covers the hole infilled with filler. The heat generated by the electronic element is conducted through the filler directly to the substrate for heat dissipation. |
| 申请公布号 |
US2016007440(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201514791745 |
申请日期 |
2015.07.06 |
| 申请人 |
SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED |
发明人 |
LEE SHUN-LONG;HUANG HONG-GUANG |
| 分类号 |
H05K1/02;H05K1/18;H05K3/30;H05K3/12;H05K3/40 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat dispersion structure, comprising:
a substrate; a printed circuit board mounted on the substrate, defining a hole filled with a filler; and wherein heat generated by an electronic element positioned on the filler is conducted from the filler to the substrate for heat dissipation. |
| 地址 |
Zhongshan CN |
