发明名称 アブレーション加工方法
摘要 <p>An ablation method of applying a laser beam to a workpiece to perform ablation. The ablation method includes a protective film forming step of applying a liquid resin containing a powder having absorptivity to the wavelength of the laser beam to at least a subject area of the workpiece to be ablated, thereby forming a protective film containing the powder on at least the subject area of the workpiece, and a laser processing step of applying the laser beam to the subject area coated with the protective film, thereby performing ablation through the protective film to the subject area of the workpiece after performing the protective film forming step.</p>
申请公布号 JP5839390(B2) 申请公布日期 2016.01.06
申请号 JP20110221705 申请日期 2011.10.06
申请人 株式会社ディスコ 发明人 北原 信康;大浦 幸伸
分类号 B23K26/36;B23K26/00;B23K26/18 主分类号 B23K26/36
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