首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
TUERVERKLEIDUNGSPROFIL MIT ECKVERBINDUNG.
摘要
申请公布号
DE1982017(U)
申请公布日期
1968.03.28
申请号
DE196700P9964U
申请日期
1967.08.31
申请人
ERNST PELZ
发明人
ERNST PELZ
分类号
主分类号
代理机构
代理人
主权项
地址
您可能感兴趣的专利
METAL FOIL WITH CONDUCTIVE LAYER AND METHOD OF ITS MANUFACTURING
NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY
RECHARGEABLE BATTERY
SECONDARY BATTERY
Organometallic Complex, Light-Emitting Element, Light-Emitting Device, Electronic Device, and Lighting Device
ACTIVE MATERIALS FOR ELECTRO-OPTIC DEVICES AND ELECTRO-OPTIC DEVICES
MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
THERMOELECTRIC DEVICE AND THERMOELECTRIC SYSTEM INCLUDING THE DEVICE
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE
METHOD OF MANUFACTURING LIGHT EMITTING DIODE
METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
METHOD FOR MANUFACTURING AN OPTICAL UNIT AND ELECTRONIC APPARATUS
LED ELEMENT WITH PROTECTING LAYER
HYBRID MULTI-JUNCTION PHOTOVOLTAIC CELLS AND ASSOCIATED METHODS
INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH CONTAMINATION IMPROVEMENT
METHOD FOR MANUFACTURING SPLIT-GATE POWER DEVICE
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
JUNCTIONLESS FIELD-EFFECT TRANSISTOR HAVING ULTRA-THIN LOW-CRYSTALLINE-SILICON CHANNEL AND FABRICATION METHOD THEREOF
SILICON RECESS ETCH AND EPITAXIAL DEPOSIT FOR SHALLOW TRENCH ISOLATION (STI)