METHOD OF MAKING DEMOUNTABLE INTERCONNECT STRUCTURE

摘要

PURPOSE: A method of making a demountable interconnect structure is provided to remove inferior electronic device from interconnection structure or arbitrary inferiority remaining part. CONSTITUTION: A method of making a demountable interconnect structure is comprised of the steps: coating a first metal layer(24) on an electronic device including more than one I/O contact unit(18); locating the first metal layer on the surface t of I/O contact unit; coating a disposable layer(26) on the electronic device so that it is adjacent to the first metal layer; coating a bonding layer(16) on the electronic device or a base insulation layer(10); and fixing the contact layer on the base insulation layer by using the bonding layer.