发明名称 |
A semiconductor wafer with a heteroepitaxial layer and a method for producing the wafer |
摘要 |
<p>A semiconductor wafer comprising a substrate having a first side and a second side; a fully or partially relaxed heteroepitaxial layer deposited on the first side of the substrate; and a stress compensating layer deposited on the second side of the substrate. The wafer is produced in a method comprising depositing on a first side of a substrate a fully or partially relaxed heteroepitaxial layer at a deposition temperature; and before cooling the wafer from the deposition temperature, providing a stress compensating layer on a second side of the substrate.</p> |
申请公布号 |
EP2104135(A1) |
申请公布日期 |
2009.09.23 |
申请号 |
EP20080005334 |
申请日期 |
2008.03.20 |
申请人 |
SILTRONIC AG |
发明人 |
STORCK, PETER, DR.;VORDERWESTNER, MARTIN |
分类号 |
H01L21/02;H01L21/20 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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