发明名称 METHOD FOR FORMING END SURFACE ELECTRODE OF CHIP TYPE ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for forming an end surface electrode of a chip type electrode component in which the end surface electrode can be formed in uniform thickness from the end surface of a strip-like substrate to both front and rear sides.SOLUTION: Both ends in the longitudinal direction of a stripe-like substrate 10 are inserted into a groove 20a provided in a holder 20 and are held therein, and, while bringing the end surface of the stripe-substrate 10 into contact with a conductive paste 31 coated on a transfer table 30 in this state, the holder 20 is reciprocated in the plate thickness direction of the stripe-like substrate 10, thereby after the conductive paste 31 is turned around greatly from the end surface of the stripe-like substrate 10 to the front side and the rear side, the end surface of the stripe-like substrate 10 is made to be separated from the conductive paste 31 by descending the transfer table 30.
申请公布号 JP2015207597(A) 申请公布日期 2015.11.19
申请号 JP20140085730 申请日期 2014.04.17
申请人 KOA CORP 发明人 KARASAWA SEIJI
分类号 H01C17/28 主分类号 H01C17/28
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