发明名称 Method of manufacturing display device
摘要 According to one embodiment, a method of manufacturing a display device, includes preparing a first substrate configured such that a first display element module is formed on a first glass substrate, preparing a second substrate configured such that a first peeling auxiliary layer is formed on a second glass substrate, and then a first color filter layer is formed on the first peeling auxiliary layer, attaching the first display element module and the first color filter layer, and peeling the second glass substrate from the first peeling auxiliary layer.
申请公布号 US9190575(B2) 申请公布日期 2015.11.17
申请号 US201314025973 申请日期 2013.09.13
申请人 Japan Display Inc. 发明人 Kawata Yasushi
分类号 H01L21/00;H01L33/48;H01L27/32 主分类号 H01L21/00
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A method of manufacturing a display device, comprising: preparing a first substrate configured such that a first display element module comprising a plurality of display elements is formed in a first region on a first glass substrate and a second display element module comprising a plurality of display elements is formed in a second region on the first glass substrate, the second region being spaced apart from the first region; preparing a second substrate configured such that a first peeling auxiliary layer having an island shape is formed on a second glass substrate, a second peeling auxiliary layer having an island shape, which is spaced apart from the first peeling auxiliary layer, is formed on the second glass substrate, and then a first color filter layer is formed on the first peeling auxiliary layer and a second color filter layer is formed on the second peeling auxiliary layer; attaching the first display element module and the first color filter layer, and attaching the second display element module and the second color filter layer; peeling the second glass substrate from the first peeling auxiliary layer and the second peeling auxiliary layer by radiating a laser beam toward the second substrate; and cutting the first substrate between the first region and the second region.
地址 Minato-ku JP