发明名称 NON-WETTING COATING ON FLUID EJECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a non-wetting coating on a fluid ejection device. SOLUTION: A method of forming the non-wetting coating on the fluid ejection device includes: a step of applying an oxygen plasma to a substrate to form an outer part of the substrate having a density that is larger than that of an interior part of the substrate; and a step of applying a non-wetting coating to an exterior surface of the outer part. The outer part has a thickness of below 8 nm. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011121357(A) 申请公布日期 2011.06.23
申请号 JP20100186386 申请日期 2010.08.23
申请人 FUJIFILM CORP 发明人 OKAMURA YOSHIMASA
分类号 B41J2/135 主分类号 B41J2/135
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